Riga UB55

Riga
Riga UB55 Riga UB55
Faced panel
Riga
UB55
SUPPORT: Chipboard, MDF
  • FORMAT: 2800 x 2070 mm
    THICKNESS: from 8 to 38 mm
  • TEXTURE ORIENTATION: Vertical
    BACK TEXTURE: Fiocco
    NOMINAL OVERTHICKNESS: +0.3 mm
Laminate
Riga
UB55
TYPE: HPL
  • FORMAT: 2760 x 2040 mm
    THICKNESS: 0.9 mm
Edge
Riga
UB55
TYPE: ABS
  • HEIGHT: from 15 to 330 mm
    THICKNESS: from 0.5 to 2.5 mm

Products by effect

Pictures and descriptions should be considerate for illustration purposes only. Cleaf reserves the right to make, at any time and without notice, any necessary modifications for commercial or manufacturing purposes. The finished product might have different shades from the picture presented.