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Ceppo LS66

Ceppo
Ceppo LS66 Ceppo LS66
Faced panel
Ceppo
LS66
SUPPORT: Chipboard, MDF
  • FORMAT: 5600 x 2070 mm
    THICKNESS: from 8 to 38 mm
    • TEXTURE ORIENTATION: Vertical
    BACK TEXTURE: Ceppo
    NOMINAL OVERTHICKNESS: +0.1 mm
Laminate
Ceppo
LS66
TYPE: HPL
  • FORMAT: 2760 x 2040 mm
    THICKNESS: 0.9 mm
Edge
Ceppo
LS66
TYPE: ABS
  • HEIGHT: from 15 to 330 mm
    THICKNESS: from 0.5 to 2.5 mm

Suggested products

Ceppo PRODUCTS

Pictures and descriptions should be considerate for illustration purposes only. Cleaf reserves the right to make, at any time and without notice, any necessary modifications for commercial or manufacturing purposes. The finished product might have different shades from the picture presented.