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Ceppo LS63

Ceppo
Ceppo LS63 Ceppo LS63
Faced panel
Ceppo
LS63
SUPPORT: Chipboard, MDF
  • FORMAT: 5600 x 2070 mm
    THICKNESS: from 8 to 38 mm
    • TEXTURE ORIENTATION: Vertical
    BACK TEXTURE: Ceppo
    NOMINAL OVERTHICKNESS: +0.1 mm
Laminate
Ceppo
LS63
TYPE: HPL
  • FORMAT: 2760 x 2040 mm
    THICKNESS: 0.9 mm
Edge
Ceppo
LS63
TYPE: ABS
  • HEIGHT: from 15 to 330 mm
    THICKNESS: from 0.5 to 2.5 mm

Suggested products

Ceppo PRODUCTS

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